I created a custom modular typeface for the relevant names and information that would be debossed into Telink's chip faces. The typeface needed to be legible on a range of chip sizes, some as small as 4mm tall and wide.
Camille Rapay / Product design, 3D, packaging design
Tiffany Licata / Supervisor, internal design feedback
2019
Branding / Packaging design / 3D
YEAR
SKILLS
Information technology
INDUSTRY
Telink Semiconductor creates custom SoCs for client's IoT needs. After having undergone an extensive rebrand with a new visual identity courtesy of Thunderfoot, I was tasked with creating 3D product visuals for the website, new packaging, print collateral, and merchandise.