I created a custom modular typeface for the relevant names and information that would be debossed into Telink's chip faces. The typeface needed to be legible on a range of chip sizes, some as small as 4mm tall and wide.

Camille Rapay / Product design, 3D, packaging design

Tiffany Licata / Supervisor, internal design feedback

2019

Branding  /  Packaging design  /  3D

YEAR

SKILLS

Information technology

INDUSTRY

Telink Semiconductor creates custom SoCs for client's IoT needs. After having undergone an extensive rebrand with a new visual identity courtesy of Thunderfoot, I was tasked with creating 3D product visuals for the website, new packaging, print collateral, and merchandise.